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Ball Grid Array Rework and Repair Distron specializes in the placement, inspection and rework of ball grid array (BGA), fine pitch ball grid array (Micro BGA) and chip scale packages (CSP). We have extensive experience with ball grid array (BGA) components as small as .5mm pitch. Special technical knowledge and processing equipment is essential to successfully manufacture circuit boards containing these package types.The critical factors for successful BGA assembly include these following:
PCB Layout & Solder Finish Distron believes that proper pad layout and solder finish are critical components of solder joint quality. Distron recommends that a PCB designer layout the PCB conforming to IPC-SM-782A Surface Mount Design and Land Pattern Standards. Our advanced manufacturing engineering staff recommends the use of OSP and Nickel/Gold finishes for high performance and reliability.
Stencil Design & Screen PrintingDistron manufacturing engineering has a wide variety of experience in stencil design. Aperture size directly effects paste release and solder volume. Our engineering team will carefully design your stencil adjusting apertures and thickness to control the amount of paste and ensure proper paste release. Proper stencil design is the foundation of the reflow process.BGA Placement & Reflow Both of our SMT Lines, Mydata MY15 line and Phillips Topaz Line, are capable of placing BGAs and Micro BGAs. Specific reflow parameters are developed for each board including heating rates, dwell times and cooling rates. The reflow profile ensures optimal solder flow and eliminates unnecessary damage to plastic component packages.
BGA Rework. BGA Inspection.Distron uses an X-ray analysis tool, VJ Electronix Model VJ-1000LP, for process monitoring and as a failure analysis tool. BGA rework, if required, takes place on Martin line 9000. Moisture sensitivity is a critical issue for BGA devices, particularly during rework and repair. If the exposure time exceeds the floor life for the component to be replaced, then the board will be baked to remove the moisture.
Distron Provides BGA Rework Services Throughout the Following Areas:
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Call 508-695-8786 Email: sales@Distron.com  Download company brochure
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