|
|
|
|
| |
Ball Grid Array
Distron specializes in the placement, inspection and rework of ball grid array (BGA), fine pitch ball grid array (Micro BGA) and chip scale packages (CSP). We have extensive experience with ball grid array (BGA) components as small as .5mm pitch. Special technical knowledge and processing equipment is essential to successfully manufacture circuit boards containing these package types.
The critical factors for successful BGA assembly include these following: |
|
 |
- PCB Layout & Solder Finish
- Stencil Design & Screen Printing
- BGA Placement & Reflow
- BGA Inspection & Rework
|
| |
PCB Layout & Solder Finish
Distron believes that proper pad layout and solder finish are critical components of solder joint quality. Distron recommends that a PCB designer layout the PCB conforming to IPC-SM-782A Surface Mount Design and Land Pattern Standards. Our advanced manufacturing engineering staff recommends the use of OSP and Nickel/Gold finishes for high performance and reliability. |
|
 |
Stencil Design & Screen Printing
Distron manufacturing engineering has a wide variety of experience in stencil design. Aperture size directly effects paste release and solder volume. Our engineering team will carefully design your stencil adjusting apertures and thickness to control the amount of paste and ensure proper paste release. Proper stencil design is the foundation of the reflow process. |
Ball Grid Array (BGA) Placement & Reflow
|
| |
Both of our SMT Lines, Mydata MY15 line and Phillips Topaz Line, are capable of placing BGAs and Micro BGAs. Specific reflow parameters are developed for each board including heating rates, dwell times and cooling rates. The reflow profile ensures optimal solder flow and eliminates unnecessary damage to plastic component packages. |
|
 |
Ball Grid Array (BGA) Inspection & Rework
Distron uses an X-ray analysis tool, VJ Electronix Model VJ-1000LP, for process monitoring and as a failure analysis tool. Rework, if required, takes place on Martin line 9000. Moisture sensitivity is a critical issue for BGA devices, particularly during rework and repair. If the exposure time exceeds the floor life for the component to be replaced, then the board will be baked to remove the moisture. |
| |
|
|
|
|
© 2006 Distron Corporation.
All Rights Reserved.
Massachusetts
(MA) Website Design Development
Electronic
Contract Manufacturing Services, Ball Grid Array, Electromechanical
Assemblies, Flex Circuit & Surface Mount Assembly,
Connecticut,
CT, Maine, ME, Massachusetts, MA, Maryland, MD,
New Hampshire, NH, New Jersey, NJ,
New York, NY, Rhode Island, RI, Vermont,
VT
Ball
Grid Array | Electromechanical
Assemblies | Electronic
Contract Manufacturing
Electronic Manufacturing Services | Flex
Circuit | Surface Mount Assembly
Expanded Capabilities | RoHS Compliant
|
