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2007 Expanded SMT
Manufacturing Capacity & Capabilities |
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Distron has invested over $1M in equipment, software and training to improve our current capacity.
Our engineering staff has qualified and selected equipment to support our growth and improve our technology offering.
Surface mount placement capacity has increased 50% and quality levels have improved by over 20%. |
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Added Surfact Mount Capacity |
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- Purchased of a new semi-automatic Ekra Screen Printer
- Purchased Mydata Synergy Line: fully automated in-line process for high volume production featuring the board train function which loads multiple boards simultaneously for increased throughput. Synergy line is a two machine concept that provides ultimate flexibility. Enhanced software tools for line balancing and feeder optimization and the ability to predict assembly times based on feeder configuration.
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Installed Aegis Software |
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Aegis is a comprehensive, modular software tool that prepares data for manufacturing equipment. The software speeds up new product introductions by simplifying the upfront data preparation and creates color-coded manufacturing documentation to ensure process control. Checkpoint software improves bill of material accuracy by finding reference designator mismatches and potential AVL issues. Circuitcam reduces machine setup time by linking real time with the Mydata component libraries. Component and package data is loaded offline without impacting production. |
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Expanded Capability |
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- Purchased Agilis feeders and the Mydata Synergy line easily places 0201 components consistently and accurately.
- Purchased a Selective Solder Machine (Pillarhouse Jade S-200) Selective soldering offers repeatable, point to point soldering capability for pin-through-hole components on SMT boards and eliminates manual soldering. Dual solder pots provide capability for Lead Free and Tin Lead soldering.
- Purchased a dedicated RoHS wave soldering equipment - Electrovert Econopak Gold wave solder machine designed for Lead Free applications, provides flexibility and quick changeover, lead free nozzle design improves hole fill on lead free applications with minimal dross generation. Cast iron solder pot and components are resistant to the corrosive effects of lead free materials.
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Increased Staffing and Training |
Distron hired New Quality Manager with 30 years of quality engineering experience and added additional personnel in program management and manufacturing/test engineering. A state funded software training program was initiated to teach employees to use our advanced ERP systems throughout the factory. |
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Improved Factory Layout |
The Distron factory layout has been optimized to reduce non-value handling.
Work cells have been re-located to promote a streamlined flow and Lean Manufacturing techniques. The footprint for the electro-mechanical assembly/order fulfillment work cell has expanded by more than 30% to provide additional capability for box build assemblies.
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© 2006 Distron Corporation. All Rights Reserved.
Massachusetts (MA) Website Design Development
Electronic Contract Manufacturing Services, Ball Grid Array, Electromechanical Assemblies, Flex Circuit & Surface Mount Assembly,
Connecticut, CT, Maine, ME, Massachusetts, MA, Maryland, MD, New Hampshire, NH, New Jersey, NJ,
New York, NY, Rhode Island, RI, Vermont, VT
Ball Grid Array | Electromechanical Assemblies | Electronic Contract Manufacturing
Electronic Manufacturing Services | Flex Circuit | Surface Mount Assembly
Expanded Capabilities | RoHS Compliant
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